Statistics
Publications
1
Citations
14
H-Index
1
Active since
2002
T.H. Chew is an author specializing in underfill materials, microfabrication, and chip packaging.
Publications per year
2002–2002
1
1
Assessment of flip chip assembly and reliability via reflowable underfill
Tie Wang, T.H. Chew, Christopher W. Lum et al. · 2002 · 14 citations
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