A Bi-Layer compact thermal model for uniform chip temperature control with non-uniform heat sources by genetic-algorithm optimized microchannel cooling

Conduction of heat in solids

C. J. Tranter · Journal of the Mechanics and Physics of Solids · 1959 · 18.5K citations

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High-performance heat sinking for VLSI

David B. Tuckerman, R. F. W. Pease · IEEE Electron Device Letters · 1981 · 5.2K citations

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Heat and fluid flow in high-power LED packaging and applications

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Experimental microchannel heat sink performance studies using nanofluids

Reiyu Chein, Jason Chuang · International Journal of Thermal Sciences · 2006 · 399 citations

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Review of Cooling Technologies for Computer Products

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Engineering, Computer Engineering, Computer Systems +17