Yiwen Fan

Thermal modeling and comparative analysis of jet impingement liquid cooling for high power electronics

Ruikang Wu, Tao Hong, Qingyu Cheng et al. · International Journal of Heat and Mass Transfer · 2019 · 85 citations

Electrical Engineering, Engineering, High Power Electronics +10

An immersed jet array impingement cooling device with distributed returns for direct body liquid cooling of high power electronics

Ruikang Wu, Yiwen Fan, Tao Hong et al. · Applied Thermal Engineering · 2019 · 81 citations

Electrical Engineering, Engineering, High Power Electronics +9

Thermal interface materials with sufficiently vertically aligned and interconnected nickel-coated carbon fibers under high filling loads made via preset-magnetic-field method

Xinfeng Zhang, Shuling Zhou, Bin Xie et al. · Composites Science and Technology · 2021 · 71 citations

Materials Engineering, Materials Science, Engineering +12

High-performance thermal management system for high-power LEDs based on double-nozzle spray cooling

Linyi Xiang, Yanhua Cheng, Xingjian Yu et al. · Applied Thermal Engineering · 2023 · 49 citations

Engineering, Liquid Metal Cooling, High-power Leds +7

A Bi-Layer compact thermal model for uniform chip temperature control with non-uniform heat sources by genetic-algorithm optimized microchannel cooling

Ruikang Wu, Xinfeng Zhang, Yiwen Fan et al. · International Journal of Thermal Sciences · 2018 · 41 citations

Electrical Engineering, Heat Transfer Process, Engineering +11