Concepedia

Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations

Daniela Cavallaro, Rosario Greco, Gaetano Bazzano

Microelectronics Reliability · 2018 · 24 citations · 3 references

DOI

Concepts

References

3

An empirical relation defining the stress dependence of minimum creep rate in metals.

F. Garofalo · 1963 · 196 citations

, , +16

Evaluation of Fatigue Life of Semiconductor Power Device by Power Cycle Test and Thermal Cycle Test Using Finite Element Analysis

Kazunori Shinohara, Qiang Yu · Engineering · 2010 · 15 citations · Full text

, , +17

Thermal-mechanical fatigue reliability of pbsnag solder layer of die attachment for power electronic devices

Xinpeng Xie, Xiangdong Bi, Guoyuan Li · 2009 · 11 citations

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