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Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Materials Science3D Ic ArchitectureChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Wafer Scale ProcessingMicrofabricationChip AttachmentElectronic PackagingMicroelectronics3D PrintingVia-last Tsvs