Publication | Closed Access

Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part I: Cavitation characteristics

Materials ScienceCavitating FlowEngineeringPower UltrasoundMicrofabricationCorrosionHydrodynamic CavitationMechanical EngineeringAcoustic CavitationUltrasonic-assisted SolderingFiller Metal/substrate InterfaceUltrasoundCavitation CharacteristicsMicrostructure