Publication | Open Access

Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling

Electrical EngineeringHigh Temperature StorageEngineeringHardware ReliabilityBias Temperature InstabilityDevice ReliabilityThermal CyclingCircuit ReliabilityHeat TransferPower ElectronicsElectronic PackagingPower Electronics InterconnectionsElectrical Insulation