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Ga<sub>2</sub>O<sub>3</sub>MOSFETs Using Spin-On-Glass Source/Drain Doping Technology
128
Citations
21
References
2017
Year
SemiconductorsSpintronicsElectrical EngineeringMaterials ScienceMaterials EngineeringEngineeringSemiconductor TechnologySog S/d DopingWide-bandgap SemiconductorApplied PhysicsCondensed Matter PhysicsFirst DemonstrationSog DopingSemiconductor Device
We report the first demonstration of source/drain (S/D) doping using tin (Sn) doped spin-on-glass (SOG) on Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> power MOSFET. The effectiveness of SOG doping is verified by a comparative experiment on semi-insulating Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> substrates. A specific contact resistance of ρ <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</sub> = 2.1±1.4×10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-5</sup> Ω·cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> is obtained to the SOG doped layer. The thermal diffusion behavior of Sn in Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> is investigated as well. MOSFETs with SOG S/D doping is fabricated on 200-nm epitaxial Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> layer with an average effective doping of 2×10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">17</sup> /cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> . An increased peak output drain current density of 40 mA/mm is achieved due to reduced S/D resistance. The maximum transconductance (g <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">m</sub> ) is extracted to be 1.23 mS/mm for a device with L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">g</sub> = 2μm. The device also shows a large ON/OFF ratio of 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">8</sup> and breakdown voltage of 382 V.
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