2003 · 13 citations · 1 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesSystem-on-chip DesignDigital Integrated CircuitsIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationMixed-signal Integrated Circuit DesignMixed-signal IntegrationCopper MetallizationDual Damascene ProcessMetallizationMixed-signal Co-designMixed-signal LayoutSystem-on-chip IntegrationTechnology Platform Selection
A 0.18 /spl mu/m high performance/low power technology platform is described which allows 'system on a chip integration' for a broad spectrum of products. Based on a generic digital process additional modules can be added in a modular and cost effective-manner for mixed signal as well as for eDRAM applications offering a maximum of flexibility for product designers. For mixed signal applications a precision metal-insulator-metal capacitor (MIMCAP) was developed. This is for the first time a realization of a metal-insulator-metal capacitor in a copper dual damascene metallization scheme.
1
1997 symposium on VLSI technology
Symposium on VLSI Technology · 1997 · 65 citations
Engineering, Computer Engineering, Electrical Engineering +12