Successful transferring of active transistors, rf-passive components and high density interconnect from bulk si to organic substrates

Abstract

A thermal bonding based wafer-transfer-technology (WTT) has been developed and successfully applied to transfer active devices, RF-passive components and high density interconnect pre-fabricated by CMOS technology onto a flexible organic substrate. The intrinsic performances of transistors and interconnect are preserved with excellent reliability, and the RF-passive components are clearly demonstrated in much enhanced RF characteristics