Surface and Interface Analysis · 2016 · 25 citations · 17 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials CharacterizationSemiconductor MaterialsSurface ScienceAlloysEpitaxial GrowthSemiconductor SurfacesSurface MicroscopySurface PhysicsSurface RoughnessCritical ThicknessEpitaxial Film GrowthMetastable Alloy PhasesMolecular Beam EpitaxyRoughness EvolutionSurface GrowthSurface RougheningTemperature-dependent Growth
Abstract Metastable Germanium–tin (GeSn) layers with rather high Sn content between 15% and 18% grown on Si substrates by molecular beam epitaxy were analyzed for the morphological changes on a surface before and after reaching critical layer parameters (thickness, Sn content, and growth temperature) for surface roughening. Atomic‐force microscopy investigations were performed as a function of thickness and separately for varying Sn concentrations in the GeSn layer. Epitaxial growth of metastable, uniform GeSn (15% Sn content) layers is obtained up to a critical thickness which increases from about 80 to above 200 nm by reducing the nominal growth temperature from 160 to 140 °C. Phase separation of the complete layer into tin‐rich surface protrusions and a Ge‐rich matrix takes place beyond the critical thickness. This surface roughening via phase separation was not observed in earlier investigations with lower Sn concentrations (<6%). Tin depletion in the GeSn matrix was confirmed by using energy‐dispersive X‐ray spectroscopy measurements showing residual Sn concentration below 5%. Additionally, creation of droplets with high concentration of tin on the surfaces was confirmed by energy‐dispersive X‐ray spectroscopy. Copyright © 2016 John Wiley & Sons, Ltd.
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Natural Sciences, Materials Engineering, Materials Science +10