Reliability aspects of copper metallization and interconnect technology for power devices - Concepedia

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Reliability aspects of copper metallization and interconnect technology for power devices

17

Citations

9

References

2016

Year

F. Hille, Roman Roth, C. Schäffer, H. Schulze, Nicolas Heuck, Daniel Bolowski, Karsten Guth, A. Ciliox, Karina Rott, Frank Umbach,

Microelectronics Reliability

ReliabilityMaterials ScienceElectrical EngineeringReliability EngineeringEngineeringElectromigration TechniqueHardware ReliabilityPower DevicesCorrosionReliability AspectsInterconnect (Integrated Circuits)Circuit ReliabilityElectronic PackagingDevice ReliabilityMicroelectronicsMicrostructureCopper Metallization

References

	Year	Citations

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