Novel interface material used in high power electronic die-attaching on bare Cu substrates

The Nature of the Chemical Bond and the Structure of Molecules and Crystals

C. K. Ingold · Nature · 1940 · 828 citations

Natural Sciences, Chemistry, Crystal Structure +11

Metal–metal bonding process using Ag metallo-organic nanoparticles

Eiichi Ide, Shinji Angata, Akio Hirose et al. · Acta Materialia · 2005 · 498 citations

Natural Sciences, Materials Engineering, Materials Science +10

Mechanical properties of nano-silver joints as die attach materials

Kim S. Siow · Journal of Alloys and Compounds · 2011 · 384 citations

Natural Sciences, Materials Engineering, Materials Science +12

Microstructure and mechanical behavior of porous sintered steels

Nikhilesh Chawla, Xin Deng · Materials Science and Engineering A · 2004 · 320 citations

Natural Sciences, Materials Engineering, Materials Science +12

Low-temperature low-pressure die attach with hybrid silver particle paste

Katsuaki Suganuma, S. Sakamoto, Noriko Kagami et al. · Microelectronics Reliability · 2011 · 283 citations

Natural Sciences, Materials Engineering, Materials Science +8