Concepedia
Rare Metal Materials and Engineering · 2016 · 28 citations · 13 references
EngineeringMaterials EngineeringMaterials ScienceMechanical Behavior Of MaterialsMetallurgyDurabilityFatigueFracture MechanicsFracture ToughnessSemiconductor ReliabilityFatigue BehaviorJoint FatigueLow-cycle FatigueSolder Joint Residual StressSoldered Joints
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Computational modeling of the forward and reverse problems in instrumented sharp indentation
Ming Dao, Nuwong Chollacoop, Krystyn J. Van Vliet et al. · Acta Materialia · 2001 · 1.5K citations
Engineering, Materials Engineering, Mechanical Engineering +12
Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength
J.H.L. Pang, T.H. Low, B.S. Xiong et al. · Thin Solid Films · 2004 · 198 citations
Natural Sciences, Materials Engineering, Materials Science +9
Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys
Yoshiharu Kariya, Masahisa Otsuka · Journal of Electronic Materials · 1998 · 161 citations
Natural Sciences, Materials Engineering, Materials Science +14
Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
J.H.L. Pang, K H Tan, Xu Shi et al. · Materials Science and Engineering A · 2001 · 156 citations
Engineering, Materials Engineering, Materials Science +16
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
C. Andersson, Z. Lai, J. Liu et al. · Materials Science and Engineering A · 2005 · 119 citations