New high reliability bondless pressure contact IGBTs.

Abstract

The electrical and thermal characteristics of a range of new bondless pressure contact IGBT’s, with ratings of 400A and 1400A at 1800V, are presented. The characteristics of the bondless pressure contact devices are compared to substrate mounted devices of similar ratings and the possible advantages in some applications are considered. The bondless pressure contact devices are found to have comparable electrical characteristics to substrate mounted devices. However due to differences in the mechanical and thermal properties, these devices may offer exploitable advantages in some applications.