F. Wakeman

Electromechanical characteristics of a bondless pressure contact IGBT

F. Wakeman, K. Billett, R. Irons et al. · 1999 · 30 citations

Engineering, Electrical Engineering, Microelectronics +5

Long term short-circuit stability in Press-pack IGBTs

F. Wakeman, J. E. Pitman, Stefan Steinhoff · 2016 · 21 citations

Engineering, Electrical Engineering, Microelectronics +15

Design, analysis, and testing of PP‐IGBT‐based submodule stack for the MMC VSC HVDC with 3000 A DC bus current

Huifeng Chen, F. Wakeman, J. E. Pitman et al. · The Journal of Engineering · 2018 · 17 citations · Full text

Engineering, Electrical Engineering, Computational Fluid Dynamics +16

Press-pack IGBTs, semiconductor switches for pulse power

F. Wakeman, W. Findlay · IEEE Conference Record - Abstracts. PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science and 13th IEEE International Pulsed Power Conference (Cat. No.01CH37255) · 2002 · 14 citations

Engineering, Electrical Engineering, Microelectronics +16

Application of press-pack IGBTs in traction refurbishment

A. Golland, F. Wakeman · Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, 2005. APEC 2005. · 2005 · 13 citations

Engineering, Electrical Engineering, Power Electronics +16