Publication | Closed Access
Diverse Accessible Heterogeneous Integration (DAHI) at Northrop Grumman Aerospace Systems (NGAS)
15
Citations
3
References
2014
Year
Unknown Venue
Wide-bandgap SemiconductorEngineeringAerospace SystemSystem IntegrationAerospace SystemsElectronic EngineeringHeterogeneous IntegrationSystems EngineeringData IntegrationModeling And SimulationGallium NitrideElectrical EngineeringSpace-air-ground Integrated NetworkAvionics SystemProcess Design KitMicroelectronicsThree-dimensional Heterogeneous IntegrationAerospace EngineeringGan Power DeviceIndium Phosphide
Northrop Grumman Aerospace Systems (NGAS) under the Diverse Accessible Heterojunction Integration (DAHI) DARPA program is developing heterogeneous integration processes, process design kit (PDK) and thermal analysis tools to integrate deep submicron CMOS, Indium Phosphide (InP) heterojunction bipolar transistors (HBTs), Gallium Nitride (GaN) high electron mobility transistors (HEMTs) and high-Q passive technologies for advanced DoD and other government systems.
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