Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

Constitution of Binary Alloys

Max Hansen, K. Anderko, H. W. Salzberg · Journal of The Electrochemical Society · 1958 · 14.8K citations

Natural Sciences, Chemistry, Materials Science +8

Constitution of Binary Alloys.

Harold Margolin · Journal of the American Chemical Society · 1959 · 1.6K citations

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Current-induced marker motion in gold wires

H. B. Huntington, A. Gröne · Journal of Physics and Chemistry of Solids · 1961 · 836 citations

Engineering, Electrical Engineering, Physics +13

Interstitial Diffusion of Copper in Tin

B. F. Dyson, T. R. Anthony, David Turnbull · Journal of Applied Physics · 1967 · 382 citations

Natural Sciences, Materials Engineering, Materials Science +6

Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

H. Gan, K. N. Tu · Journal of Applied Physics · 2005 · 267 citations · Full text

Engineering, Materials Engineering, Materials Science +17