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A Comprehensive Benchmark and Optimization of 5-nm Lateral and Vertical GAA 6T-SRAMs
35
Citations
24
References
2015
Year
Wide-bandgap SemiconductorEngineeringVlsi DesignEmerging Memory TechnologyLateral Gaa TransistorsVertical GaaIntegrated CircuitsSemiconductor DeviceRf SemiconductorNanoelectronicsElectronic EngineeringSuperconductivitySram BitcellsElectrical EngineeringComputer EngineeringComprehensive BenchmarkMicroelectronics5-Nm LateralVfet BitcellSemiconductor MemoryBeyond CmosOptoelectronics
In this paper, we present an intensive study of 6T-SRAM designs for vertical gate-all-around (GAA) transistors (VFETs) and lateral GAA transistors (LFETs) using 5-nm node design rules. Optimizations of the nanowire (NW) diameter and the gate length are also conducted to enhance the SRAM performance. Device VT retargeting has been proposed for improving the minimum operating voltage (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">min</sub> ) of SRAMs. The isoperformance and isoyield have been performed to assess and determine the benefits provided by LFET and VFET architectures, respectively. Our results show that the VFET bitcells are denser than the LFET bitcells by 20%-30%. The SRAM read stability (read static noise margin) is significantly improved using the NW channel. For a 6σ yield target and an isoarea of SRAM bitcells, V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">min</sub> of the VFET bitcell is 80 mV lower than LFET designs. Applying the proposed VT retargeting technique can allow the VFET 122 bitcell to operate at 0.57 V without using assist circuits. A standby leakage below 10 pA/cell can be achieved for both architectures. At isoperformance, the standby leakage of VFET bitcells is 2.6× lower than LFET bitcells.
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