Preparation of Ce-doped colloidal SiO2 composite abrasives and their chemical mechanical polishing behavior on sapphire substrates

Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials

Hideo Aida, Toshiro Doi, Hidetoshi Takeda et al. · Current Applied Physics · 2012 · 257 citations

Engineering, Materials Engineering, Materials Science +14

Chemical mechanical polishing (CMP) anisotropy in sapphire

Honglin Zhu, Luiz A. Tessaroto, Robert Sabia et al. · Applied Surface Science · 2004 · 178 citations

Engineering, Materials Engineering, Materials Science +9

Influence of Colloidal Abrasive Size on Material Removal Rate and Surface Finish in SiO₂Chemical Mechanical Polishing

Chunhong Zhou, Lei Shan, J. Robert Hight et al. · Tribology Transactions · 2002 · 93 citations

Engineering, Materials Engineering, Materials Science +17

Synthesis, characterization of CeO2@SiO2 nanoparticles and their oxide CMP behavior

Xiaobing Zhao, Long Renwei, Chen Yang et al. · Microelectronic Engineering · 2009 · 73 citations

Natural Sciences, Materials Engineering, Materials Science +12

Preparation of monodisperse polystyrene/silica core–shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper

Lei Zhang, Haibo Wang, Zefang Zhang et al. · Applied Surface Science · 2011 · 67 citations

Natural Sciences, Materials Engineering, Materials Science +14