Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly

What is the Young's Modulus of Silicon?

Matthew A. Hopcroft, William D. Nix, Thomas W. Kenny · Journal of Microelectromechanical Systems · 2010 · 2K citations

Engineering, Multiscale Mechanics, Micromechanics +22

Quality engineering (Taguchi methods) for the development of electronic circuit technology

Genichi Taguchi · IEEE Transactions on Reliability · 1995 · 208 citations

Total Quality Management, New Technologies, Engineering +26

Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits

Leila Ladani · Microelectronic Engineering · 2009 · 113 citations

Numerical Analysis, Thermo-mechanical Reliability, Electrical Engineering +15

Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints

J.H.L. Pang · Journal of Alloys and Compounds · 2012 · 108 citations

Materials Science, Imc Layer, Engineering +8

Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling

J.H.L. Pang · IEEE Transactions on Device and Materials Reliability · 2012 · 105 citations

Engineering, Life Prediction, Mechanical Engineering +16