Evaluation of thermal performance of packaged GaN HEMT cascode power switch by transient thermal testing

Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters—A Review

Yvan Avenas, Laurent Dupont, Zoubir Khatir · IEEE Transactions on Power Electronics · 2011 · 535 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

GaN HEMT reliability

Jesús A. del Alamo, Jungwoo Joh · Microelectronics Reliability · 2009 · 483 citations

A new evaluation method of thermal transient measurement results

V. Székely · Microelectronics Journal · 1997 · 432 citations

Engineering, Computer Engineering, Heat Transfer +16

Evaluation and Application of 600 V GaN HEMT in Cascode Structure

Xiucheng Huang, Zhengyang Liu, Qiang Li et al. · IEEE Transactions on Power Electronics · 2013 · 404 citations

Engineering, Electrical Engineering, Microelectronics +16

Package Parasitic Inductance Extraction and Simulation Model Development for the High-Voltage Cascode GaN HEMT

Zhengyang Liu, Xiucheng Huang, Fred C. Lee et al. · IEEE Transactions on Power Electronics · 2013 · 289 citations

Engineering, Electrical Engineering, Microelectronics +16