Journal of Micromechanics and Microengineering · 2015 · 33 citations · 22 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMechanical Behavior Of MaterialsThin FilmsSemiconductor Device MaterialsSemiconductor Thin FilmsThin Film Electrical PropertiesThin Film Mechanical PropertiesThin-film DepositionThin-film MaterialsElectrical Properties AnalysisFilm StressNitride Thin FilmsNitrides Thin FilmsResistivitySputter DepositionSputteringX-ray Diffraction Analysis
Molybdenum and molybdenum nitride thin films are presented, which are deposited by reactive dc magnetron sputtering. The influence of deposition parameters, especially the amount of nitrogen during film synthesization, to mechanical and electrical properties is investigated. The crystallographic phase and lattice constants are determined by x-ray diffraction analyses. Further information on the microstructure as well as on the biaxial film stress are gained from techniques such as transmission electron microscopy, scanning electron microscopy and the wafer bow. Furthermore, the film resistivity and the temperature coefficient of resistance are measured by the van der Pauw technique starting from room temperature up to 300 °C. Independent of the investigated physical quantity, a dominant dependence on the sputtering gas nitrogen content is observed compared to other deposition parameters such as the plasma power or the sputtering gas pressure in the deposition chamber.
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TEM Sample Preparation and FIB-Induced Damage
Joachim Mayer, Lucille A. Giannuzzi, Takeo Kamino et al. · MRS Bulletin · 2007 · 873 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +6
<i>Standard X-Ray Diffraction Powder Patterns</i>
Howard E Swanson, Eleanor Tatge, Ruth K. Fuyat · Physics Today · 1954 · 654 citations