NBTI: An Atomic-Scale Defect Perspective

Abstract

We utilize a combination of MOSFET-gate controlled diode DC-IV measurements and a very sensitive electrically-detected electron spin resonance technique called spin-dependent recombination to observe and identify defect centers generated during NBTI in fully processed SiO 2 and plasma nitrided oxide (PNO)-based pMOSFETs. In SiO 2 devices, we observe the NBTI-induced generation of two Si/SiO 2 interface silicon dangling bond centers (P b0 and P b1 ) and very likely an oxide silicon dangling bond center (E'). Our observations indicate that both P b0 and P b1 defects play major roles in these SiO 2 -based devices and also suggest that E' centers could play an important role. In PNO devices, we observed the NBTI-induced generation of a new defect center which is fundamentally different from the P b0 /P b1 defects generated during NBTI in SiO 2 devices. Our results indicate that it plays a dominating role in NBTI-induced interface state generation in thin PNO devices and also exhibits a post-negative bias temperature stress (NBTS) recovery. Although we observe different interface state defects, we observed essentially equivalent activation energies in both the SiO 2 and PNO devices

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