Metallic microstructures fabricated using photosensitive polyimide electroplating molds

Abstract

A polyiimide-based process for the fabrication of thick (1-150 mu m), sharp-sidewall, high-aspect-ratio electroplated microstructures is presented. This process is a low-cost alternative to the LIGA process for microstructure fabrication. Although this process cannot match the performance of the LIGA process, it uses ordinary optical masks and ultraviolet light exposure, resulting in simple and inexpensive equipment requirements. Using this technology, structures made of a variety of electroplated metals can be fabricated. Vertically integrated structures that exploit the multilayer ability of the polyimides used can also be realized. Surface micromachining with this process can be used to fabricate movable electroplated microactuators.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>