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Study of the Erase Mechanism of MANOS ($ \hbox{Metal/Al}_{2}\hbox{O}_{3}/\hbox{SiN/SiO}_{2}/\hbox{Si}$) Device
17
Citations
6
References
2007
Year
Materials ScienceDevice ModelingElectrical EngineeringEngineeringTunneling MicroscopyPhysicsErase CharacteristicsTunnel OxideSurface ScienceApplied PhysicsErase MechanismStress-induced Leakage CurrentSemiconductor Device FabricationErase CurveMicroelectronicsSemiconductor Device
The erase characteristics and mechanism of metal- Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> -nitride-oxide-silicon (MANOS) devices are extensively studied. We use transient analysis to transform the erase curve (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">FB</sub> - time) into a J-E curve (J = transient current, E = field in the tunnel oxide) in order to understand the underlying physics. The measured erase current of MANOS is three orders of magnitude higher than that can be theoretically provided by substrate hole current. In addition, the erase current is very sensitive to the Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> processing condition - also inconsistent with substrate hole injection model. Thus, we propose that MANOS erase occurs through an electron detrapping mechanism. We have further carried out a refill test and its results support the detrapping model. Our results suggest that the interfacial layer between Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> and nitride is a key process that dominates the erase mechanism of MANOS.
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