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Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages

Reliability EngineeringEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)MicrofabricationWafer-level Chip-scale PackagesChip On BoardMechanical EngineeringBoard-level Thermomechanical ReliabilityHardware ReliabilityComputer EngineeringChip AttachmentElectronic PackagingMicroelectronicsThermal EngineeringMechanics Of Materials