Journal of Microelectromechanical Systems · 2002 · 320 citations · 8 references
EngineeringElectrical EngineeringMechanical EngineeringCeramic MaterialsCeramicsSensorsElectrical Properties Of CeramicsMechanical SensorsMicroelectromechanical SensorsPressure SensorsTemperature MeasurementTemperature SensorsCeramic SensorsFabricationHigh-temperature SensorsLc OscillatorsMicromachined SensorsPressure Sensor CharacterizationTemperature SensingWireless Pressure Sensors
In high-temperature applications, such as pressure sensing in turbine engines and compressors, high-temperature materials and data retrieval methods are required. The microelectronics packaging infrastructure provides high-temperature ceramic materials, fabrication tools, and well-developed processing techniques that have the potential for applicability in high-temperature sensing. Based on this infrastructure, a completely passive ceramic pressure sensor that uses a wireless telemetry scheme has been developed. The passive nature of the telemetry removes the need for electronics, power supplies, or contacts to withstand the high-temperature environment. The sensor contains a passive LC resonator comprised of a movable diaphragm capacitor and a fixed inductor, thereby causing the sensor resonant frequency to be pressure-dependent. Data is retrieved with an external loop antenna. The sensor has been fabricated and characterized and was compared with an electromechanical model. It was operated up to 400/spl deg/C in a pressure range from 0 to 7 Bar. The average sensitivity and accuracy of three typical sensors are: -141 kHz Bar/sup -1/ and 24 mbar, respectively.
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Wireless micromachined ceramic pressure sensors
Jennifer M. English, Mark G. Allen · 1999 · 60 citations
α(6H)-SiC pressure sensors for high temperature applications
Robert S. Okojie, A.A. Ned, A. D. Kurtz et al. · 2002 · 33 citations