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Statistical Variability in Fully Depleted SOI MOSFETs Due to Random Dopant Fluctuations in the Source and Drain Extensions
45
Citations
9
References
2012
Year
Device ModelingLow-power ElectronicsElectrical EngineeringRandom Dopant FluctuationsEngineeringVlsi DesignThreshold Voltage DistributionNanoelectronicsDrain ExtensionsStatistical VariabilityApplied PhysicsThreshold VoltageComputer EngineeringBias Temperature InstabilityStandard DeviationMicroelectronicsSemiconductor Device
Simulations of up to 10 000 fully depleted thin-body silicon-on-insulator MOSFETs show that the standard deviation of the threshold voltage cannot be adequately used as a sole metric of device variability in such transistors. This is due to a sharp departure from normality of the threshold voltage distribution, and an enhanced influence of the source/drain-dopant fluctuations on the on-current and short-channel effects of the fully depleted thin-body silicon-on-insulator transistors. Both aspects have great ramifications for statistical compact models and for low-power SRAM designs.
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