Characterization of oxidized copper leadframes and copper/epoxy molding compound interface adhesion in plastic package

Abstract

For plastic packages, copper leadframes can provide many advantages such as good thermal and electrical performance, and cost effectiveness. Copper is, however, susceptible to popcorn cracking during the surface mounting process on the PCB due to poor adhesion between the leadframe and EMC (epoxy molding compound). Experimental results showed that the adhesion strength between copper leadframes and the EMC was affected by alloy composition, CuO/Cu/sub 2/O ratios, oxide layer thickness, and oxidation conditions. The growth of the oxide layer for the Cr-Zr copper alloy was faster than for Ni-Si copper alloys, while the latter had lower adhesion strength than the former. The adhesion strength of the copper alloys depended on the CuO/Cu/sub 2/O ratio rather than oxide thickness. The adhesion strength was highest at a CuO/Cu/sub 2/O ratio of 0.2/spl sim/0.3, regardless of alloy composition and oxide thickness. We found that this was caused by the segregation effect of soluble elements at the oxide/leadframe interface.