Statistics
Publications
1
Citations
80
H-Index
1
Active since
2002
Affiliations
Springhouse(Current)
S. Kim is an author at Springhouse specializing in applied physics, mechanics of materials, and electronic packaging.
Publications per year
2002–2002
1
1
The role of plastic package adhesion in IC performance
S. Kim · 2002 · 80 citations
Materials Science, Advanced Packaging, Adhesion Characteristics +14
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