Temperature compensated LiTaO/sub 3//sapphire saw substrate for high power applications

Abstract

A new temperature-compensated SAW substrate for high power applications was developed based on bonded LiTaO3/sapphire. Because of its small thermal expansion coefficient, large Young's modulus, and large electric resistivity, sapphire is an ideal material for a support substrate. In addition, the large thermal conductivity of sapphire brings efficient heat dissipation. Surface activated bonding was used and optimized to strongly bond LiTaO3 and sapphire without any damage or bow. Keywords-SAW; LiTaO3; sapphire; temperature compensation; surface activated bonding; heat dissipation; US-PCS;