Temperature compensated LiTaO/sub 3//sapphire bonded saw substrate with low loss and high coupling factor suitable for US-PCS application - Concepedia

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Temperature compensated LiTaO/sub 3//sapphire bonded saw substrate with low loss and high coupling factor suitable for US-PCS application

41

Citations

5

References

2005

Year

M. Miura, T. Matsuda, Y. Satoh, M. Ueda, O. Ikata, Y. Ebata, Hideo D. Takagi

Unknown Venue

Materials EngineeringMaterials ScienceLitao/sub 3//SapphireEngineeringHigh Coupling FactorMechanical EngineeringApplied PhysicsSaw SubstrateBonded Litao/sub 3//SapphireMicroelectronics

Abstract

A novel temperature-compensated SAW substrate was developed based on bonded LiTaO/sub 3//sapphire. Because of its small TEC (thermal expansion coefficient) and large Young's modulus, sapphire is an ideal material for a support substrate. The frequency and temperature characteristics of the bonded LiTaO/sub 3//sapphire SAW substrate and its application to a US-PCS duplexer are described.

References

	Year	Citations

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