M. Miura

Recent development of temperature compensated SAW Devices

Ken-ya Hashimoto, Michio Kadota, Takeshi Nakao et al. · 2011 · 83 citations

Natural Sciences, Electrical Engineering, Materials Science +12

Temperature compensated LiTaO/sub 3//sapphire bonded saw substrate with low loss and high coupling factor suitable for US-PCS application

M. Miura, T. Matsuda, Y. Satoh et al. · 2005 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +10

Experimental Studies of Quality Factor Deterioration in Shear-Horizontal-Type Surface Acoustic Wave Resonators Caused by Apodization of Interdigital Transducer

Satoru Matsuda, M. Miura, Takashi Matsuda et al. · Japanese Journal of Applied Physics · 2011 · 40 citations

Natural Sciences, Materials Science, Physics +16

Temperature compensated LiTaO/sub 3//sapphire saw substrate for high power applications

M. Miura, Takanori Matsuda, M. Ueda et al. · 2006 · 36 citations

Natural Sciences, Materials Engineering, Materials Science +13

<scp>IL</scp>‐28B (<scp>IFN</scp>‐λ3) and <scp>IFN</scp>‐α synergistically inhibit <scp>HCV</scp> replication

Hiroko Shindo, Shinya Maekawa, Kazuki Komase et al. · Journal of Viral Hepatitis · 2012 · 28 citations · Full text

Life Sciences, Genetics, Infectious Diseases +17