2007 · 15 citations · 5 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesDamage MechanicsDevice ReliabilityFailure TheoriesMems ReliabilitySemiconductor ReliabilityWork HardeningCmos ReliabilityElectromigrationStress-induced FailureThermo-mechanical DeformationThermo-mechanical EffectsThermo-mechanical FailureThermo-mechanical StressThermomechanical Stress
In this article the failure behavior of DMOS-switches under power-cycle stress is shown to be dominated by thermo-mechanical deformation of the metallization. The failure evolves without a significant influence from electromigration stress.
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A new cycle test system emulating inductive switching waveforms
Michael Glavanovics, Helmut Köck, H. Eder et al. · 2007 · 16 citations