Publication | Closed Access
Successive Oxide Breakdown Statistics: Correlation Effects, Reliability Methodologies, and Their Limits
42
Citations
24
References
2004
Year
EngineeringChip Reliability AssessmentReliability EngineeringSuccessive EventsReliabilityElectrical EngineeringHardware ReliabilityBias Temperature InstabilityTime-dependent Dielectric BreakdownComputer EngineeringReliability MethodologiesReliability PredictionDevice ReliabilityMicroelectronicsCorrelation EffectsPhysic Of FailureSuccessive Oxide BreakdownCircuit ReliabilityTheir Limits
This paper deals with the statistics of successive oxide breakdown (BD) events in MOS devices. Correlation effects between these successive events are experimentally related to the statistics of BD current jumps, thus suggesting that they are related to lateral propagation of the BD path. The application of the successive BD theory to chip reliability assessment is discussed. Several failure criteria and the related reliability methodologies are considered and some of their limits are established.
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