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Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination

Materials ScienceEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationChip On BoardSurface ScienceApplied PhysicsChip AttachmentContact Angle DeterminationComparative CharacterizationElectronic PackagingMolecular EngineeringMicroelectronicsMolecular ModelingInterface Structure