A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology

Abstract

An optoelectronic transceiver module is described consisting of a four-channel AlGaAs integrated laser/monitor transmitter and a four-channel GaAs MESFET integrated detector/preamp receiver. The optoelectronic chips are flip-chip, solder-bump bonded to a substrate containing electrical wiring and planar-processed optical waveguides. The optical waveguide layer serves two purposes: the routing of optical signals, as well providing mechanical registrations for the optoelectronic chips and fiber-optic ribbon connector. The work described here demonstrates one approach to high-density, optoelectronic array packaging compatible with existing high-performance electronic packaging technology.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>