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p-Type SiGe transistors with low gate leakage using SiN gate dielectric
18
Citations
15
References
1999
Year
Sige HeterostructuresElectrical EngineeringP-type Sige TransistorsEngineeringRf SemiconductorHigh-frequency DeviceStress-induced Leakage CurrentElectronic EngineeringBias Temperature InstabilityApplied PhysicsSemiconductor Device FabricationIntegrated CircuitsLow Gate LeakageMicroelectronicsSin Gate DielectricGate DielectricSemiconductor Device
Using high-quality jet-vapor-deposited (JVD) SiN as gate dielectric, p-type SiGe transistors are fabricated on SiGe heterostructures grown by ultra-high-vacuum chemical vapor deposition (UHVCVD). For an 0.25-μm gate-length device, the gate leakage current is as small as 2.4 nA/mm at V/sub ds/=-1.0 V and V/sub gn/=0.4 V. A maximum extrinsic transconductance of 167 mS/mm is measured. A unity current gain cutoff frequency of 27 GHz and a maximum oscillation frequency of 35 GHz are obtained.
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