Publication | Closed Access
A simple technique to measure generation lifetime in partially depleted SOI MOSFETs
14
Citations
9
References
1998
Year
Effective Generation LifetimeElectrical EngineeringEngineeringHardware ReliabilityInch WafersGeneration LifetimeNanoelectronicsBias Temperature InstabilitySimple TechniqueApplied PhysicsTime-dependent Dielectric BreakdownSoi MosfetsCircuit ReliabilitySemiconductor Device FabricationElectronic PackagingSilicon On InsulatorMicroelectronicsDevice Reliability
This work presents a new, simple method of measuring the generation lifetime in silicon-on-insulator (SOI) MOSFETs. Lifetime is extracted from the transient characteristics of MOSFET subthreshold current. Using this technique, generation lifetime was mapped across finished SIMOX (Separation by IMplantation of OXygen) wafers and BESOI (Bonded and Etchedback SOI) wafers. BESOI material evaluated in this study had about seven times longer effective generation lifetime than SIMOX material and both the SIMOX and the BESOI are shown to have a lifetime variation of /spl plusmn/10% across four inch wafers.
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