IEEE Electron Device Letters · 2007 · 22 citations · 26 references
SemiconductorsSemiconductor TechnologyElectrical EngineeringEngineeringGrain GrowthLateral Grain GrowthApplied PhysicsExcimer Laser CrystallizationSemiconductor Device FabricationOptoelectronic DevicesIntegrated CircuitsThin FilmsSilicon On InsulatorSemiconductor Device
In this letter, high-performance low-temperature polysilicon thin-film transistors (TFTs) with double-gate (DG) structure and controlled lateral grain growth have been demonstrated by excimer laser crystallization. Via a proper excimer laser condition, along with the a-Si step height beside the bottom gate, a superlateral growth of Si was formed in the channel length plateau. Therefore, the DG TFTs with lateral silicon grains in the channel regions exhibited better current-voltage characteristics, as compared with the conventional top-gate ones. The proposed DG TFTs ( <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">W</i> / <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i> = 1/1 mum) had the field-effect mobility exceeding 550 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /Vmiddots, an on/off current ratio that is higher than 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">8</sup> , superior short-channel characteristics, and higher current drivability. In addition, the device-to-device uniformity could be improved since grain growth could be artificially controlled by the spatial plateau structure.
26
Silicon-on-insulator 'gate-all-around device'
J.-P. Colinge, M.-H. Gao, A. Romano‐Rodrı́guez et al. · 2002 · 346 citations
Semiconductor Technology, Electrical Engineering, Engineering +15