Simulation of uniaxial tensile properties for lead-free solders with modified Anand model

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.3K citations

Reliability, Electrical Engineering, Reliability Engineering +10

An internal variable constitutive model for hot working of metals

Stuart C. Brown, K KIM, Lallit Anand · International Journal of Plasticity · 1989 · 747 citations

Materials Science, Engineering, Mechanical Engineering +10

Constitutive equations for hot-working of metals

Lallit Anand · International Journal of Plasticity · 1985 · 579 citations

Materials Science, Engineering, Physics +7

Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

G. Z. Wang, Zhilin Cheng, Karl‐Friedrich Becker et al. · Journal of Electronic Packaging · 1998 · 313 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +20

Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders

W. T. Chen, Cheng–En Ho, C. R. Kao · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 208 citations

Materials Engineering, Materials Science, Interfacial Reactions +8