2012 · 12 citations · 0 references
EngineeringComputer EngineeringElectrical EngineeringHeat TransferMicroelectronicsSemiconductor DevicesIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationInterconnect DesignInterconnect TechnologyThermal ManagementElectrical Interconnect DesignHeat RemovalHeat Sink DesignHeat SinksInterconnect Network DesignInterconnect Thermal ManagementPower DensityThree-dimensional Integration
Future high performance 3D systems require a systematic co-design of their electrical interconnect network and their heat removal mechanism. This paper presents fine pitch (20μm) and high aspect ratio (18:1) TSVs integrated in a micropin-fin heat sink capable of removing power density of 100W/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and resulting in junction temperatures below 50°C.