IEEE Electron Device Letters · 2008 · 178 citations · 16 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsCarrier TransportSemiconductor Device MaterialsSemiconductor HeterostructuresSemiconductor PhysicsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsAluminum Gallium NitrideAluminum NitrideCarrier MobilityCharge Carrier MobilityCurrent OutputGallium NitrideHeterojunctionsHigh-electron-mobility Transistors
High-electron mobility transistors (HEMTs) based on ultrathin AIN/GaN heterostructures with a 3.5-nm AlN barrier and a 3-nm Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> gate dielectric have been investigated. Owing to the optimized AIN/GaN interface, very high carrier mobility (~1400 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /V ldr s) and high 2-D electron-gas density (~2.7times10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">13</sup> /cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> ) resulted in a record low sheet resistance (~165 Omega/sq). The resultant HEMTs showed a maximum dc output current density of ~2.3 A/mm and a peak extrinsic transconductance g <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">m,ext</sub> ~480 mS/mm (corresponding to g <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">m,int</sub> ~1 S/mm). An f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> /f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> of 52/60 GHz was measured on 0.25times60 mum <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> gate HEMTs. With further improvements of the ohmic contacts, the gate dielectric, and the lowering of the buffer leakage, the presented results suggest that, by using AIN/GaN heterojunctions, it may be possible to push the performance of nitride HEMTs to current, power, and speed levels that are currently unachievable in AlGaN/GaN technology.
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AlGaN/GaN metal oxide semiconductor heterostructure field effect transistor
M.A. Khan, X. Hu, G. Sumin et al. · IEEE Electron Device Letters · 2000 · 383 citations