2013 · 10 citations · 3 references
EngineeringElectrical EngineeringMicroelectromechanical SystemsMicroelectronicsMicrowave EngineeringMems CharacterizationMems DesignMems SwitchesMems TestingRf MemsBandwidthData Bus ArchitectureElectrical Testing Of Mems DevicesHigh-frequency CharacterizationHot SwitchingPower HandlingRf Mems SwitchesSize
Wide I/O poses serious challenges due to the requisite high density of electronics and relays near the DUT, as well as high bandwidth. A 2×2mm MEMS switch has been demonstrated, offering >80% footprint reduction relative to a typical TO-can electromagnetic relay. A further benefit of its small size, the MEMS relay is able to operate up to Ka-band (40 GHz) with hot switch capability and repeatability of <;±50mΩ. To our knowledge, our latest SPDT device holds the current record in power handling for MEMS devices of 24 W at 10 million cycles.
3
Evaluation of TSV and micro-bump probing for wide I/O testing
Ken R. Smith, Peter Hanaway, Mike Jolley et al. · 2011 · 57 citations
Engineering, Electrical Engineering, Mechanical Engineering +14