Concepedia

Microstructure in copper interconnects – Influence of plating additive concentration

Jürgen Neuner, I. Zienert, A. Peeva, Axel Preuße, Peter Kücher, Johann W. Bartha

Microelectronic Engineering · 2009 · 17 citations · 16 references

DOI

Concepts

References

16

The conductivity of thin metallic films according to the electron theory of metals

K. Fuchs · Mathematical Proceedings of the Cambridge Philosophical Society · 1938 · 2.3K citations

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Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces

A. F. Mayadas, M. Shatzkes · Physical review. B, Solid state · 1970 · 2.2K citations

, , +17

Stress and grain growth in thin films

Carl V. Thompson, R. Carel · Journal of the Mechanics and Physics of Solids · 1996 · 503 citations

, , +14

The chemistry of additives in damascene copper plating

Philippe M. Vereecken, Robert A. Binstead, Hariklia Deligianni et al. · IBM Journal of Research and Development · 2005 · 450 citations

, , +17

The mean free path of electrons in metals

E. H. Sondheimer · Advances In Physics · 2001 · 388 citations

, , +14