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High–performance, low–power, and leakage–tolerance challenges for sub–70nm microprocessor circuits
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2002
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Low-power ElectronicsHardware SecurityElectrical EngineeringEngineeringVlsi DesignTechnology ScalingVlsi ArchitectureNew Design ChallengesLeakage Power DissipationHigh-performance ArchitectureComputer EngineeringComputer ArchitectureCmos Technology ScalingIntegrated CircuitsParallel ComputingMicroelectronicsBeyond CmosTolerance Challenges
CMOS technology scaling is becoming difficult beyond 70nm node, raising new design challenges for high-performance and low-power microprocessors. This paper discusses some of the key paradigm shifts required. Circuit techniques to combat (i) increasing switching and leakage power dissipation, (ii) poor leakage tolerance of large-signal cache arrays and register files, (iii) worsening global on-chip interconnect scaling trend, and (iv) high-performance robust datapath circuits enabling up to 10GHz ALU and instruction scheduler loops in 130nm dual-Vt CMOS technology are described.