Transient Current Capacities of Bond Wires in Hybrid Microcircuits

Abstract

The transient temperature behavior of short fine wires subjected to short-lived electrical pulses has been examined for application to bond wires in hybrid microcircuits. Closed-form solutions are presented for constant current pulses and are evaluated for simplified situations which neglect end conduction to the connections. Predictions are compared to fusing data for short wires. For application to design, it is recommended that results for two limiting conditions--steady-state specifications and transients without heat loss-be employed,