2003 · 21 citations · 4 references
EngineeringElectrical EngineeringAnalog ElectronicsMicroelectronicsMicrowave EngineeringElectronics TechnologyIntegrated Circuit DesignLow-noise Circuit DesignNoise In Analog CircuitsNoise In Electronic DevicesRadio-frequency Integrated CircuitsHigh PerformanceHigh-frequency ElectronicsHigh-frequency IsolationInductive Power TransferLayout Techniques For Noise ReductionPackaging For High-frequency DevicesParasitic Capacitance ReductionSelf-inductance
Significant reduction of power/ground inductive impedance and SSN suppression was successfully demonstrated by using embedded capacitor film in high performance package and PCB up to 3GHz frequency range. The reduction of the inductance impedance and SSN are acquired by the help of reduced via inductance in the embedded film capacitor.
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