Publication | Closed Access
Significant reduction of power/ground inductive impedance and simultaneous switching noise by using embedded film capacitor
21
Citations
4
References
2003
Year
Unknown Venue
EngineeringRadio FrequencyPower ElectronicsEmbedded Capacitor FilmInterconnect (Integrated Circuits)Electromagnetic CompatibilityNoise ReductionPower/ground Inductive ImpedanceMixed-signal Integrated CircuitNoiseEmbedded Film CapacitorElectronic PackagingElectronic CircuitInductance ImpedanceElectrical EngineeringSignificant ReductionHigh-frequency DeviceMicroelectronicsLow-power ElectronicsFilm Capacitor
Significant reduction of power/ground inductive impedance and SSN suppression was successfully demonstrated by using embedded capacitor film in high performance package and PCB up to 3GHz frequency range. The reduction of the inductance impedance and SSN are acquired by the help of reduced via inductance in the embedded film capacitor.
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