Publication | Closed Access

The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics

Materials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringDiffusion ResistancePhysicsApplied PhysicsLow-k Interlevel DielectricsTime-dependent Dielectric BreakdownCu DiffusionMicroelectronicsElectrical PropertyTddb BehaviorElectrical Insulation